Use:

1. The clean after the appearance cutting of the substrate ‘s processing
2 . The clean before electrical testing.
3 . Other substrate cleaning.

Features:

1. With rotary brush up and down to remove foreign matter in a time.

2. With resonance air to remove the foreign matter which in the upper and lower surfaces 、cavities and slit forcefully.

3. With dust Collectors (optional)to recycle the scattering foreign matter.

4 . Only when the substrate by injecting air, reducing the burden of the compressor to a minimum.

5. Can be processed automatically loading 、unloading and a variety of site conditions on the lines.