Product
- Automatic-Reflow Line eries
- V-CUT & slop-edge equipment
- Drill and punch equipment
- Semiconductor packaging transfer molding press
- Automatic Machine
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- FPCB&RPCB Visual inspection machine
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- FPCB&RPCB Wet process Surface Treatment Equipment
- Screen Film Loop inspection device
- process equipment for touch control products
- Developing device
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- OTHER MACHINE
Multi-Point Compensating Punching Machine for Inner Layer Boards MIP-708
Scope :
Punch device can follow the compensation coordinate shifting in X & Y direction, more flexible to accommodate to PCB aperture position variation performing inner-layer benchmark aperture punch.
Features :
1.Multi-point compensation system
2.Respond to thin board aperture punch
3.Fast response to PCB hole deviation
4.Zero compensation; auto zero compensation
5.Punch is performed after PCB is qualification classified.
6.Expression of engineering management
Other：
Multi-Point Compensating Punching Machine for Inner Layer Boards MIP-708
内層板用多点振分式パンチングマシン MIP-708