Product
- Automatic-Reflow Line eries
- V-CUT & slop-edge equipment
- Drill and punch equipment
- Semiconductor packaging transfer molding press
- Automatic Machine
- FPCB&RPCB Exposing equipment
- FPCB&RPCB Visual inspection machine
- FPCB&RPCB Printing facilities
- FPCB&RPCB press machine
- FPCB&RPCB Wet process Surface Treatment Equipment
- Screen Film Loop inspection device
- process equipment for touch control products
- Developing device
- Welding Machine
- OTHER MACHINE
IC Substrate Reflow Line
IC Substrate Reflow Line
Other：
Characteristics
Fully automatic production,high linear speed,high capacity,and
low cost of use
High-precision visual calibration and lamination
High-efficiency dust control design （1000-level dust-free room）
Integrated design of upper and lower double rolls of copper foil
sending,whichis space-savingStabilized ultra-thin 1010PP separation
Ultra-thin 1/3 copper foil with 99.7%yield rate of copper wrinkling
Intelligent controlling system,barcode scanning of materials and
ERP-MES system for quick process switching,as well as products
manufacturing process tracking
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Product Specifications |
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