Product
- Automatic-Reflow Line eries
- V-CUT & slop-edge equipment
- Drill and punch equipment
- Semiconductor packaging transfer molding press
- Automatic Machine
- FPCB&RPCB Exposing equipment
- FPCB&RPCB Visual inspection machine
- FPCB&RPCB Printing facilities
- FPCB&RPCB press machine
- FPCB&RPCB Wet process Surface Treatment Equipment
- Screen Film Loop inspection device
- process equipment for touch control products
- Developing device
- Welding Machine
- OTHER MACHINE
Substrate Cutting and Packaging System

Substrate Cutting and Packaging System
Other:
Characteristics
Automatic height measurement and separation in thefront section
Automatic weighing to identify the number of substrates
The kraft paper discharging device to reduce the waste
Special air-catching device for less air in the package
Automatic labeling device,without manual labeling
Automatic vacuum suction device to reduce scratches
from packaging movement